The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Aug. 20, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
Yukimasa Hayashida, Fukuoka, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Failure analysis and recycle of a semiconductor device are facilitated, and a production efficiency of the semiconductor device is improved. An exterior includes an inner space and an inner surface surrounding the inner space. A semiconductor chip is housed in the inner space and mounted on the inner surface. A first sealing material fills the inner space, is disposed on the inner surface to be overlapped on the semiconductor chip, and is made up of silicone gel. A waterproof water-repellent layer is housed in the inner space, disposed on the inner surface to be overlapped on the semiconductor chip and the first sealing material, and made up of fluorine-series resin or silicone-series resin. A second sealing material fills the inner space, is disposed on the inner surface to be overlapped on the semiconductor chip, the first sealing material, and the waterproof water-repellent layer, and is made up of silicone gel.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile