The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

May. 29, 2013
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Shigeru Hasegawa, Tokyo, JP;

Kazuhiro Morishita, Tokyo, JP;

Ryo Tsuda, Tokyo, JP;

Yukimasa Hayashida, Fukuoka, JP;

Goro Yasutomi, Fukuoka, JP;

Ryutaro Date, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 29/16 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 25/07 (2006.01); H01L 23/492 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/492 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 25/072 (2013.01); H01L 29/1602 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A base plate, and a plurality of unit structures formed on the base plate are provided. Each of the unit structures including an insulating substrate fixed on the base plate, a metal pattern formed on the insulating substrate, a semiconductor element electrically connected to the metal pattern, and a main electrode having an upper end portion exposed to the outside and a lower end portion connected to a peripheral portion of the metal pattern closest to an outer edge of the base plate.


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