The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Nov. 17, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Takayuki Matsumoto, Fukuoka, JP;
Yukimasa Hayashida, Fukuoka, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/544 (2013.01); H01L 24/32 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/32227 (2013.01);
Abstract
A semiconductor module includes: an insulating substrate; a metal pattern provided on the insulating substrate; a solder resist provided on the metal pattern; a semiconductor chip mounted on the metal pattern at an opening portion of the solder resist; and a sealing material sealing the metal pattern, the solder resist and the semiconductor chip, wherein a suction area surrounded by a groove is provided in a portion of the solder resist.