Taoyuan, Taiwan

Yu-Te Lu

This inventor holds 21 USPTO granted patents and 8 published patent applications, primarily in Circuit Board Manufacturing. Top assignee: Kinsus Interconnect Technology Corp.. Active years: 2011-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Te Lu. Retrieved from https://idiyas.com/inventor/yu-te-lu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 85.7

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 29(Granted Patents)


Location History:

  • Taoyuan Hsien, TW (2014 - 2016)
  • Taoyuan County, TW (2016 - 2017)
  • Taoyuan, TW (2011 - 2021)

Company Filing History:


Years Active: 2011-2021

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Areas of Expertise:
Multi-Layer Circuit Board
Flip-Chip Package
Embedded Circuitry
Microthrough-Hole
Buried Capacitor Structure
Chip Support Board
Stacked Multilayer Structure
High Density Core Layer
Interlayer Conducting Structure
Laminate Circuit Board
Fine Line Substrate
Buried Element
21 patents (USPTO):Explore Patents

Title: The Innovative Mind of Yu-Te Lu: Advancements in Multi-Layer Circuit Board Technology

Introduction: Yu-Te Lu, a remarkable inventor based in Taoyuan, Taiwan, has made significant contributions to the field of electronics through his innovative patents. With a total of 21 patents to his name, he is renowned for his expertise in the manufacturing of multi-layer circuit boards, which are crucial components in modern electronic devices.

Latest Patents: Among his latest achievements, Yu-Te Lu has developed a patented method for manufacturing multi-layer circuit boards capable of undergoing electrical testing. This invention allows for a multi-layer circuit structure to be placed on a delivery loading plate, which exposes a conductive corrosion-barrier layer. The innovative design ensures that the top-layer circuit is electrically connected to this layer through a series of connections, allowing for effective electrical testing prior to the circuit board being delivered to assembly companies or packaged with chips. Another patent details a multi-layer circuit board itself, which includes a metallic delivery loading plate and various circuit structures, enhancing the reliability and efficiency of electrical connections.

Career Highlights: Yu-Te Lu works at Kinsus Interconnect Technology Corporation, a leading company in the field of interconnect technologies. His innovations not only emphasize the importance of durable and reliable circuit designs, but also showcase his role in advancing electronic manufacturing techniques that benefit the industry.

Collaborations: Throughout his career, Yu-Te Lu has collaborated with talented coworkers such as Ting-Hao Lin and Shuo-Hsun Chang. Together, they have contributed to the development of cutting-edge technologies that push the boundaries of traditional electronics.

Conclusion: Yu-Te Lu's contributions to the field of multi-layer circuit boards exemplify the spirit of innovation. As he continues to develop new technologies, his work at Kinsus Interconnect Technology Corporation underscores the ongoing evolution in the electronics sector, paving the way for more efficient and reliable electronic devices in the future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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