The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Jan. 26, 2015
Kinsus Interconnect Technology Corp., Taoyuan, TW;
Ting-Hao Lin, Taipei, TW;
Yi-Fan Kao, New Taipei, TW;
Jaen-Don Lan, New Taipei, TW;
Yu-Te Lu, Taoyuan Hsien, TW;
Yung-Lin Chia, Taoyuan County, TW;
An-Ping Tseng, Taipei, TW;
KINSUS INTERCONNECT TECHNOLOGY CORP., Taoyuan, TW;
Abstract
A method for manufacturing microthrough-hole includes electroplating a metal layer on a carrier plate, patterning the metal layer to form a first circuit having copper pads, covering the first circuit with a photoresist layer and not covering the copper window between two of the copper pads, etching the metal layer beneath the copper window and removing the photoresist layer, sequentially forming an insulation layer and a second circuit on the first circuit and the copper window, the second circuit layer having a stop pad corresponding to the copper window, removing the carrier plate, upward drilling through the insulation layer between the stop pad and the copper window to form a microthrough-hole beneath the stop pad, and forming a conductive layer in the microthrough-hole to form the microthrough-hole connecting the first and second circuits. The microthrough-hole and its occupied area is greatly reduced, thereby achieving high circuit density.