Yi-Fan Kao

Title: Yi-Fan Kao: Innovator in Flip-Chip Technology

Introduction

Yi-Fan Kao is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly in flip-chip technology. With a total of five patents to his name, Kao continues to push the boundaries of innovation in his industry.

Latest Patents

One of his latest patents is titled "Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof." This invention provides a baseplate with an opening bonded to a carrier board, forming a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. A sealant is filled in the gap between the surrounding walls of the opening and the die at a height lower than the die, effectively securing the die within the opening while leaving a non-active surface exposed. Another patent under the same title describes a compound carrier board structure that features a penetrating rectangular opening bonded to a non-conductive film and then to a carrier board. The baseplate is constructed with a low Thermal Expansion Coefficient material, enhancing the performance of the flip-chip package.

Career Highlights

Yi-Fan Kao is currently employed at Kinsus Interconnect Technology Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of flip-chip packaging solutions.

Collaborations

Kao collaborates with talented individuals in his field, including coworkers Ting-Hao Lin and Yu-Te Lu. Their combined efforts contribute to the innovative projects at Kinsus Interconnect Technology Corporation.

Conclusion

Yi-Fan Kao is a key figure in the development of flip-chip technology, with several patents that showcase his innovative spirit. His work continues to influence the semiconductor industry, paving the way for future advancements.