The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Mar. 06, 2015
Kinsus Interconnect Technology Corp., Taoyuan, TW;
Ting-Hao Lin, Taipei, TW;
Yi-Fan Kao, New Taipei, TW;
Jaen-Don Lan, New Taipei, TW;
Yung-Lin Chia, Taoyuan County, TW;
An-Ping Tseng, Taipei, TW;
KINSUS INTERCONNECT TECHNOLOGY CORP., Taoyuan, TW;
Abstract
A method for manufacturing a circuit board with a buried element having high density pin count, wherein a micro copper window formed in a first circuit by patterned dry film electroplating is easily controlled less than 50 μm so that the micro conduction holes formed after the laser drilling each has a diameter greatly shrunk less than 50 μm so as to highly increase density of the micro conduction holes, thereby facilitating in burial of the buried element with the high density pin count. Additionally, by disposing the micro conduction holes in the same elevation, optically aligning a fixing position for the buried element can be controlled precisely.