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Taoyuan, Taiwan

Kinsus Interconnect Technology Corp.

USPTO Granted Patents = 65

Trademarks = 1

Forward Citations = 87

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37 inventors (with patents filed for the assignee):

Ting-Hao Lin (45 out of 48 patents)

Yu-Te Lu (21 out of 21 patents)

Chiao-Cheng Chang (20 out of 20 patents)

4. Yi-Nong Lin (15 out of 15 patents)

5. Chien-Wei Chang (12 out of 16 patents)

6. Jun-Chung Hsu (8 out of 8 patents)

7. Shuo-Hsun Chang (7 out of 7 patents)

8. De-Hao Lu (7 out of 7 patents)

9. Yung-Lin Chia (6 out of 6 patents)

10. Chao-Lung Wang (5 out of 5 patents)

11. Yi-Fan Kao (5 out of 5 patents)

12. Chin-Kuan Liu (4 out of 4 patents)

13. Chin-Hsi Chang (4 out of 4 patents)

14. Chia-Chi Lo (4 out of 4 patents)

15. Ya-Hsiang Chen (4 out of 4 patents)

Core Competencies:

Multi-Layer Circuit Board

Electromagnetic-Interference Shielding

Winged Coil Structure

Flip-Chip Chip-Scale Package

Buildup Board Structure

Carrier Board Structure

High-Density Fine Line Structure

Thin Support Package Structure

Microthrough-Hole Technology

Stacked Multilayer Structure

Solder Pad Structure

Heat Dissipation Structure

65 patents: Sort by Forward Citations

1. 11495390 - Buildup board structure (2022-11-08),

2. 11044806 - Method for manufacturing multi-layer circuit board capable of being applied with electrical testing (2021-06-22),

3. 10882296 - Film-peeling apparatus (2021-01-05),

4. 10779418 - Manufacturing method of double layer circuit board (2020-09-15),

5. 10779405 - Landless multilayer circuit board and manufacturing method thereof (2020-09-15),

6. 10720694 - Antenna carrier plate structure (2020-07-21),

7. 10548214 - Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same (2020-01-28),

8. 10532551 - Foil peeling apparatus (2020-01-14),

9. 10455694 - Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing (2019-10-22),

10. 10440837 - Manufacturing method of double layer circuit board (2019-10-08),

11. 10440836 - Double layer circuit board (2019-10-08),

12. 10405423 - Multi-layer circuit board (2019-09-03),

13. 10383265 - Electromagnetic-interference shielding device (2019-08-13),

14. 10371719 - Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon (2019-08-06),

15. 10366822 - Method of manufacturing winged coil structure (2019-07-30),

KINSUS INTERCONNECT TECHNOLOGY CORP. is a leading provider of high-performance interconnect solutions. With expertise in advanced PCB manufacturing and integration, we deliver cutting-edge solutions for a wide range of industries including telecommunications, automotive, aerospace, and more. Our commitment to innovation and quality has earned us a strong reputation in the market, making us a trusted partner for global brands. Visit our website to learn more about our comprehensive range of interconnect technologies and solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

65 Patents

#30 in Taoyuan

#323 in Taiwan

#11,030 in the World

Taoyuan, Taiwan

Kinsus Interconnect Technology Corp.

Forward Citations = 87

37 inventors:

Ting-Hao Lin (45 out of 48 patents)

Yu-Te Lu (21 out of 21 patents)

Chiao-Cheng Chang (20 out of 20 patents)

4. Yi-Nong Lin (15 out of 15 patents)

5. Chien-Wei Chang (12 out of 16 patents)

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