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Taoyuan, Taiwan

Kinsus Interconnect Technology Corp.

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USPTO Granted Patents = 68

% Expired Patents = 16.2

Trademarks = 1

Forward Citations = 90

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37 inventors (with patents filed for the assignee):

Ting-Hao Lin (48 out of 51 patents)

Chiao-Cheng Chang (23 out of 23 patents)

Yu-Te Lu (21 out of 21 patents)

4. Chien-Wei Chang (15 out of 20 patents)

5. Yi-Nong Lin (15 out of 15 patents)

6. Jun-Chung Hsu (8 out of 8 patents)

7. Shuo-Hsun Chang (7 out of 7 patents)

8. De-Hao Lu (7 out of 7 patents)

9. Yung-Lin Chia (6 out of 6 patents)

10. Chao-Lung Wang (5 out of 5 patents)

11. Yi-Fan Kao (5 out of 5 patents)

12. Chin-Kuan Liu (4 out of 4 patents)

13. Chin-Hsi Chang (4 out of 4 patents)

14. Chia-Chi Lo (4 out of 4 patents)

15. Ya-Hsiang Chen (4 out of 4 patents)

Core Competencies:

Multilayer Circuit Board

Electromagnetic Shielding

High-Density Structures

Flip-Chip Package

Carrier Board

Solder Pad Structure

Embedded Passive Device

Thin Printed Circuit Board

Heat Dissipation Structure

Microthrough-Hole

Winged Coil Structure

Stacked Multilayer Structure

68 patents: Sort by Forward Citations

1. 12782389 - Test fixture (2026-11-03),

2. 12740419 - Anti-warpage reinforced carrier (2026-09-15),

3. 12727077 - Micro circuit structure and manufacturing method thereof (2026-09-01),

4. 11495390 - Buildup board structure (2022-11-08),

5. 11044806 - Method for manufacturing multi-layer circuit board capable of being applied with electrical testing (2021-06-22),

6. 10882296 - Film-peeling apparatus (2021-01-05),

7. 10779418 - Manufacturing method of double layer circuit board (2020-09-15),

8. 10779405 - Landless multilayer circuit board and manufacturing method thereof (2020-09-15),

9. 10720694 - Antenna carrier plate structure (2020-07-21),

10. 10548214 - Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same (2020-01-28),

11. 10532551 - Foil peeling apparatus (2020-01-14),

12. 10455694 - Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing (2019-10-22),

13. 10440837 - Manufacturing method of double layer circuit board (2019-10-08),

14. 10440836 - Double layer circuit board (2019-10-08),

15. 10405423 - Multi-layer circuit board (2019-09-03),

Company Overview

Kinsus Interconnect Technology Corp., based in Taoyuan, Taiwan, specializes in advanced circuit board technology. The company focuses on the development and manufacturing of multilayer circuit boards, high-density structures, and flip-chip packages. Kinsus is recognized for its expertise in electromagnetic shielding, carrier boards, solder pad structures, and embedded passive devices. With a commitment to innovation, Kinsus plays a significant role in enhancing the performance and reliability of electronic components across various industries.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 10 2026

68 Patents

#31 in Taoyuan

#318 in Taiwan

#10,905 in the World

Taoyuan, Taiwan

Kinsus Interconnect Technology Corp.

Forward Citations = 90

37 inventors:

Ting-Hao Lin (48 out of 51 patents)

Chiao-Cheng Chang (23 out of 23 patents)

Yu-Te Lu (21 out of 21 patents)

4. Chien-Wei Chang (15 out of 20 patents)

5. Yi-Nong Lin (15 out of 15 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Kinsus Interconnect Technology Corp.. Retrieved from https://idiyas.com/company/kinsus-interconnect-technology

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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