The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Dec. 20, 2023
Kinsus Interconnect Technology Corp., Taoyuan City, TW;
Ting-Hao Lin, Taoyuan City, TW;
Chiao-Cheng Chang, Taoyuan City, TW;
Chien-Wei Chang, Taoyuan City, TW;
KINSUS INTERCONNECT TECHNOLOGY CORP., Taoyuan, TW;
Abstract
An anti-warpage reinforced carrier includes a substrate, a plurality of rigid insulating plates, a plurality of metal posts, a resin layer, a first circuit layer, and a second circuit layer. The rigid insulating plates are arranged on the positioning areas on the substrate. The metal posts are in the second through holes penetrating through the rigid insulating plate. The resin layer covers the rigid insulating plates and the upper surface of the substrate, and includes a plurality of openings. The first circuit layer is on the resin layer and in the openings, and is connected to the metal posts. The second circuit layer is on a lower surface of the substrate and in the first through holes penetrating through the substrate, and is connected to the metal posts. By embedding rigid insulating plates therein, the anti-warpage reinforced carrier provides thermal stability, and is suitable for applications in advanced chip packaging.