Introduction: Chiao-Cheng Chang is an accomplished inventor based in Taoyuan, Taiwan, holding an impressive portfolio of 20 patents. His innovations primarily focus on advanced circuit board technology, showcasing his contributions to the fields of electronics and interconnect solutions.

Latest Patents: Among his notable patents, Chiao-Cheng Chang has developed a groundbreaking buildup board structure that incorporates magnetic induction coils and flexible boards. This design includes multiple buildup units, with each buildup body containing flexible boards embedded with magnetic induction coils. The alignment of central holes in covering layers allows for effective electrical insulation, enabling enhanced magnetic induction effects through the innovative layering of these bodies. Additionally, his patent for a landless multilayer circuit board presents an innovative manufacturing approach, featuring substrates and connecting pillars that optimize circuit connectivity while minimizing land requirements.

Career Highlights: Chiao-Cheng Chang is currently associated with Kinsus Interconnect Technology Corporation, where he leverages his expertise to advance interconnect technology. His work plays a crucial role in the development of high-performance electronic components essential for modern electronic devices.

Collaborations: Throughout his career, Chiao-Cheng Chang has collaborated with esteemed colleagues, including Ting-Hao Lin and Yi-Nong Lin. Together, they have contributed to furthering innovations in circuit board designs, enhancing functional capacities and overall efficiency.

Conclusion: Chiao-Cheng Chang's contributions to the field of interconnect technology through his innovative patents significantly impact the evolution of electronic devices. His work not only showcases his individual talent but also highlights the importance of collaboration in driving forward technological advancements in the industry.

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