The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Aug. 05, 2024
Kinsus Interconnect Technology Corp., Taoyuan City, TW;
Ting-Hao Lin, Taoyuan City, TW;
Chiao-Cheng Chang, Taoyuan City, TW;
Chien-Wei Chang, Taoyuan City, TW;
KINSUS INTERCONNECT TECHNOLOGY CORP., Taoyuan City, TW;
Abstract
A test fixture includes a probe layer, a first resin layer, a first circuit layer, a second resin layer, a second circuit layer, a solder mask layer, and a bonding pad layer. The probe layer includes probes. The first resin layer is on the probe layer. The first circuit layer is on the first resin layer and connected to the probe layer. The second resin layer is on the first circuit layer. The second circuit layer is on the second resin layer and electrically connected to the first circuit layer. The solder mask layer is on the second circuit layer and the second resin layer and has bonding pad openings. The bonding pad layer includes bonding pads in the bonding pad openings and is electrically connected to the second circuit layer. A first pitch between the bonding pads is greater than a second pitch between the probes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile