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For the Inventor, By the Inventor

Taoyuan, Taiwan

Chien-Wei Chang

This inventor holds 19 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Kinsus Interconnect Technology Corp., Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chien-Wei Chang. Retrieved from https://idiyas.com/inventor/chien-wei-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 19 

% Patents Active = 94.7

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 39(Granted Patents)


Location History:

  • Taoyuan Hsien, TW (2005)
  • Taoyuan, TW (2004 - 2023)
  • Hsin-Chu, TW (2023)

Company Filing History:

goldMedal14 out of 67 
 
Kinsus Interconnect Technology Corp.
 patents
silverMedal5 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2004-2026

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Areas of Expertise:
Wafer Bonding
Chemical Mechanical Planarization
Embedded Devices
Micro Circuit Structure
High-Density Structures
Heat Dissipation
Fine Pitch Flip Chip
Passive Device Manufacturing
Defect Reduction
Carrier Reinforcement
19 patents (USPTO):Explore Patents
1. 12740419 - Anti-warpage reinforced carrier (2026-09-15),
2. 12727077 - Micro circuit structure and manufacturing method thereof (2026-09-01),
3. 12564091 - Silicon fragment defect reduction in grinding process (2026-02-24),
4. 12234145 - Methods for wafer bonding (2025-02-25),
5. 11851325 - Methods for wafer bonding (2023-12-26),
6. 11850702 - Chemical mechanical planarization membrane (2023-12-26),
7. 11267099 - Chemical mechanical planarization membrane (2022-03-08),
8. 8471375 - High-density fine line structure and method of manufacturing the same (2013-06-25),
9. 8377815 - Manufacturing method of a semiconductor load board (2013-02-19),
10. 8312624 - Method for manufacturing a heat dissipation structure of a printed circuit board (2012-11-20),
11. 8186054 - Method of fabricating board having high density core layer and structure thereof (2012-05-29),
12. 8161639 - Method for fabricating an interlayer conducting structure of an embedded circuitry (2012-04-24),
13. 8083954 - Method for fabricating component-embedded printed circuit board (2011-12-27),
14. 8051558 - Manufacturing method of the embedded passive device (2011-11-08),
15. 7875809 - Method of fabricating board having high density core layer and structure thereof (2011-01-25),

Title: Chien-Wei Chang: Innovator from Taoyuan

Introduction: Chien-Wei Chang is a renowned inventor hailing from Taoyuan, Taiwan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Chien-Wei Chang holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his diverse expertise and innovative mindset.

Career Highlights: With a career spanning over two decades, Chang has worked with leading tech companies, research institutions, and universities, playing a pivotal role in developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Chien-Wei Chang has collaborated with top inventors, patent attorneys, and companies worldwide, fostering a culture of innovation and knowledge sharing within the global tech community.

Conclusion: Chien-Wei Chang's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a visionary inventor shaping the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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