The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2012
Filed:
Nov. 24, 2011
Chien-wei Chang, Taoyuan, TW;
Ting-hao Lin, Taipei, TW;
Ya-hsiang Chen, Yunlin, TW;
De-hao LU, Taoyuan, TW;
Chien-Wei Chang, Taoyuan, TW;
Ting-Hao Lin, Taipei, TW;
Ya-Hsiang Chen, Yunlin, TW;
De-Hao Lu, Taoyuan, TW;
Kinsus Interconnect Technology Corp., Taoyuan, TW;
Abstract
A method for manufacturing a heat dissipation structure of a printed circuit board includes: forming a barrier layer on the dimple in the first copper plating layer; forming a nickel plating layer; removing the nickel plating layer and the barrier layer on the dimple; forming a second copper plating layer to make the total height of the first copper plating layer and the second copper plating layer in the second opening higher than that of the first copper plating layer in the first opening; filling the dimple in the second copper plating layer with an etching-resistant material; removing the second copper plating layer; removing the nickel plating layer and the etching-resistant material to make the second copper plating layer in the second opening being at the same height as the first copper plating layer in the first opening; and forming the heat dissipation structure by photolithography.