The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Feb. 20, 2019
Applicant:

Kinsus Interconnect Technology Corp., Taoyuan, TW;

Inventors:

Ting-Hao Lin, Taoyuan, TW;

Chiao-Cheng Chang, Taoyuan, TW;

Yi-Nong Lin, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 7/06 (2006.01); H01F 27/28 (2006.01); H05K 3/00 (2006.01); H05K 1/00 (2006.01); H05K 1/16 (2006.01); H01F 41/04 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H05K 1/00 (2013.01); H05K 1/165 (2013.01); H05K 3/00 (2013.01); H05K 3/4635 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/09063 (2013.01);
Abstract

A method of manufacturing a winged coil structure is provided. The method includes preparing an upper flexible plate having a middle region and two side regions bordering the middle region; preparing a dielectric layer with a lateral size of the dielectric layer being the same as a lateral size of the middle region of the upper flexible plate; preparing a lower flexible plate having a middle region and two side regions bordering the middle region; preparing a bottom flexible plate attached to the lower surface of the lower flexible plate to form a stack body; and performing a process of thermal pressing to sequentially from bottom to top stack and combine the stack body, the dielectric layer, and the upper flexible plate as a multiple layered stack structure via a press mold.


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