Company Filing History:
Years Active: 2019-2021
Title: Biography of Inventor Chin-Kuan Liu
Introduction: Chin-Kuan Liu is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of four patents. His innovative work focuses on enhancing the manufacturing processes of multi-layer circuit boards.
Latest Patents: Liu's latest patents include a method for manufacturing a multi-layer circuit board capable of being applied with electrical testing. This invention allows for the electrical testing of the multi-layer circuit board before it is delivered to assembly companies or packaged with chips. The design incorporates a delivery loading plate, a bottom-layer circuit structure, and a conductive corrosion-barrier layer, ensuring efficient electrical connections.
Career Highlights: Liu has been instrumental in advancing circuit board technology through his work at Kinsus Interconnect Technology Corporation. His expertise in the field has led to the development of innovative solutions that improve the reliability and functionality of electronic devices.
Collaborations: Throughout his career, Liu has collaborated with notable colleagues, including Chao-Lung Wang and Shuo-Hsun Chang. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion: Chin-Kuan Liu's contributions to the field of circuit board technology have established him as a leading inventor in his domain. His innovative patents and collaborative efforts continue to shape the future of