The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Dec. 17, 2019
Kinsus Interconnect Technology Corp., Taoyuan, TW;
Chin-Kuan Liu, Taoyuan, TW;
Chao-Lung Wang, Taoyuan, TW;
Shuo-Hsun Chang, Taoyuan, TW;
Yu-Te Lu, Taoyuan, TW;
Chin-Hsi Chang, Taoyuan, TW;
KINSUS INTERCONNECT TECHNOLOGY CORP., Taoyuan, TW;
Abstract
A multi-layer circuit structure is disposed on the delivery loading plate through the bottom-layer circuit structure, the delivery loading plate exposes the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board.