Chin-Hsi Chang

Introduction: Chin-Hsi Chang is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of four patents. His innovative work focuses on enhancing the manufacturing processes of multi-layer circuit boards.

Latest Patents: One of his latest patents is a method for manufacturing a multi-layer circuit board capable of being applied with electrical testing. This invention involves a multi-layer circuit structure that is disposed on a delivery loading plate through a bottom-layer circuit structure. The delivery loading plate exposes a conductive corrosion-barrier layer, allowing the top-layer circuit of the multi-layer circuit structure to be electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and an electrical connection layer. This design enables electrical testing to be applied to the multi-layer circuit board before it is delivered to assembly companies or packaged with chips.

Another notable patent is a multi-layer circuit board capable of being applied with electrical testing and the method for manufacturing the same. This invention includes a metallic delivery loading plate, a bottom-layer circuit structure, a conductive corrosion-barrier layer, and a multi-layer circuit structure. The bottom-layer circuit structure overlaps the delivery loading plate, while the conductive corrosion-barrier layer is disposed on the bottom dielectric layer. The multi-layer circuit structure overlaps the bottom-layer circuit structure, ensuring that the top-layer circuit is electrically connected to the conductive