Taoyuan County, Taiwan

Chia-Chi Lo


Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Taoyuan, TW (2011 - 2012)
  • Taoyuan County, TW (2013 - 2014)

Company Filing History:


Years Active: 2011-2014

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4 patents (USPTO):Explore Patents

Title: Innovations by Chia-Chi Lo in Final Defect Inspection Technology

Introduction

Chia-Chi Lo is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of defect inspection technology, holding a total of four patents. His work focuses on enhancing the efficiency and accuracy of final defect inspections in circuit board manufacturing.

Latest Patents

Chia-Chi Lo's latest patents include a "Method of Final Defect Inspection" and a "Final Defect Inspection System." The method patent describes a comprehensive approach that involves preparing a final defect inspection apparatus, which includes a host device, a microscope, a bar code scanner, a support tool, and a signal transceiver. This method allows for the calibration of an original point on the circuit board and the marking of defect positions using an electromagnetic pen. The system patent outlines a similar apparatus, emphasizing the integration of a bar code scanner and the use of the electromagnetic pen to identify scrap regions on the circuit board.

Career Highlights

Chia-Chi Lo is currently employed at Kinsus Interconnect Technology Corp., where he continues to innovate in the field of circuit board inspection. His work has been instrumental in improving the quality control processes within the company.

Collaborations

Chia-Chi Lo collaborates with talented coworkers, including Chien-Wei Chang and Ting-Hao Lin, who contribute to the development of advanced inspection technologies.

Conclusion

Chia-Chi Lo's innovative patents and contributions to defect inspection technology highlight his role as a key figure in the industry. His work not only enhances the manufacturing process but also sets a standard for future advancements in the field.

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