The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Mar. 16, 2016
Applicant:
Kinsus Interconnect Technology Corp., Taoyuan County, TW;
Inventors:
Ting-Hao Lin, Taoyuan County, TW;
Yi-Fan Kao, Taoyuan County, TW;
Shuo-Hsun Chang, Taoyuan County, TW;
Yu-Te Lu, Taoyuan County, TW;
Kuo-Chun Huang, Taoyuan County, TW;
Assignee:
KINSUS INTERCONNECT TECHNOLOGY CORP., Shin-Wu Shiang Taoyuan County, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/3128 (2013.01); H01L 23/49833 (2013.01); H05K 3/4697 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 25/105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01); H05K 1/0206 (2013.01); H05K 1/0271 (2013.01); H05K 1/183 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/061 (2013.01);
Abstract
A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with a penetrating rectangular opening bonded to a non-conductive film then a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.