logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9831167 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

Aug. 16, 2017

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Applicant:

Kinsus Interconnect Technology Corp., Taoyuan, TW;

Inventors:

Ting-Hao Lin, Taoyuan, TW;

Yi-Fan Kao, Taoyuan, TW;

Shuo-Hsun Chang, Taoyuan, TW;

Yu-Te Lu, Taoyuan, TW;

Kuo-Chun Huang, Taoyuan, TW;

Assignee:

KINSUS INTERCONNECT TECHNOLOGY CORP., Shin-Wu Shiang, Taoyuan County, TW;

Attorneys:

Idea Intellectual Limited

Margaret A. Burke

Sam T. Yip

Primary Examiner:

William H Mayo, III

Assistant Examiner:

Krystal Robinson

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/13 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. A sealant is filled in a gap between surrounding walls of the opening and the die at a height lower than the die to fixedly place the die within the opening and to leave a non-active surface of the die exposed.

Find Patent Forward Citations

Loading…