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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9406641 B1

PDFFull Text
Date of Patent:
Aug. 02, 2016

Filed:

Jul. 10, 2013

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Applicant:

Kinsus Interconnect Technology Corp., Taoyuan County, TW;

Inventors:

Ting-Hao Lin, Taoyuan County, TW;

Yi-Fan Kao, Taoyuan County, TW;

Shuo-Hsun Chang, Taoyuan County, TW;

Yu-Te Lu, Taoyuan County, TW;

Kuo-Chun Huang, Taoyuan County, TW;

Assignee:

Kinsus Interconnect Technology Corp., Taoyuan County, TW;

Attorney:

Rosenberg, Klein & Lee

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Krystal Robinson

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 23/3128 (2013.01); H01L 23/49833 (2013.01); H05K 3/4697 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 25/105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01); H05K 1/0206 (2013.01); H05K 1/0271 (2013.01); H05K 1/183 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/061 (2013.01);
Abstract

A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate having a flip region with a through-opening and bonding to a Non-conductive Film to bond to a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.

Find Patent Forward Citations

Lin, Ting-Hao. (2016). Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof (U.S. Patent No. 9406641). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9406641

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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