The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Oct. 29, 2012
Kinsus Interconnect Technology Corp., Taoyuan, TW;
Kinsus Interconnect Technology Corp., Taoyuan, TW;
Abstract
A method of manufacturing a laminate circuit board which includes the sequential steps of metalizing the substrate to form the base layer, forming the first circuit metal layer, forming at least one insulation layer and at least one second circuit metal layer interleaved, removing the substrate, forming the support frame and forming the solder resist is disclosed. The laminate circuit board has a thickness less than 150 μm. The support frame which does not overlap the first circuit metal layer is formed on the edge of the base layer by the pattern transfer process after the substrate is removed. The base layer formed of at least one metal layer is not completely removed. The support frame provides enhanced physical support for the entire laminate circuit board without influence on the electrical connection of the circuit in the second circuit metal layer, thereby solving the warping problem.