The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Mar. 29, 2013
Applicant:

Kinsus Interconnect Technology Corp., Taoyuan, TW;

Inventors:

Ting-Hao Lin, Taipei, TW;

Yu-Te Lu, Taoyuan Hsien, TW;

De-Hao Lu, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4647 (2013.01); H05K 1/0366 (2013.01); H05K 3/38 (2013.01);
Abstract

A stacked multilayer structure, including a first circuit layer having bumps, a plastic film stacked on the first circuit layer to fill up the space among the bumps so as to form a co-plane, and a second circuit layer formed on the co-plane and connected to the first circuit layer. The plastic film includes a glass fiber layer which is embedded and not exposed.


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