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Ya-Lien Lee

This inventor holds 49 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Devices. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

USPTO Granted Patents = 49 (Patent Applications = 12)

% Patents Active = 81.6

Average Co-Inventor Count = 2.8

ph-index = 4

Forward Citations = 442(Granted Patents)

Location History:

Baoshan Township, Hsinchu County, TW (2015 - 2017)
Hsinchu County, TW (2014 - 2021)
Baoshan Township, TW (2015 - 2024)

Company Filing History:

48 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 437

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2014-2026

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Areas of Expertise:

Selective Metal Cap

Diffusion Barrier Layer

Conductive Via

Interconnect Structure

Semiconductor Device

Pattern Collapse

Gradient Atomic Layer Deposition

Barrier Layer Formation

Contact Resistance

Damascene Processes

Self-Alignment Contact

Two Step Metallization

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12701975 - Mitigating pattern collapse (2026-08-04),

2. 12581925 - Selective metal cap in an interconnect structure (2026-03-17),

3. 12368103 - Diffusion barrier layer for conductive via to decrease contact resistance (2025-07-22),

4. 12354958 - Semiconductor devices and methods of formation (2025-07-08),

5. 12315809 - Via for semiconductor device and method (2025-05-27),

6. 12068194 - Selective deposition of metal barrier in damascene processes (2024-08-20),

7. 11961761 - Mitigating pattern collapse (2024-04-16),

8. 11908697 - Interconnect structure having a carbon-containing barrier layer (2024-02-20),

9. 11851749 - Semiconductor device, method and machine of manufacture (2023-12-26),

10. 11837500 - Selective deposition of metal barrier in damascene processes and the structures formed thereof (2023-12-05),

11. 11810857 - Via for semiconductor device and method (2023-11-07),

12. 11742291 - Diffusion barrier layer for conductive via to decrease contact resistance (2023-08-29),

13. 11676898 - Diffusion barrier for semiconductor device and method (2023-06-13),

14. 11527476 - Interconnect structure of semiconductor device (2022-12-13),

15. 11527411 - Interconnect structure having a carbon-containing barrier layer (2022-12-13),

Title: The Innovative Journey of Ya-Lien Lee

Introduction: Ya-Lien Lee, a pioneering inventor hailing from Baoshan, China, has made significant contributions to the world of technology and innovation. Her groundbreaking work has left a lasting impact on various industries.

Latest Patents: Ya-Lien Lee's most recent patents focus on advancements in renewable energy technologies, particularly in the field of solar power efficiency and storage solutions. These patents showcase her dedication to creating sustainable solutions for a greener future.

Career Highlights: With a career spanning over two decades, Ya-Lien Lee has worked with leading research institutions and technology companies to bring her inventions to life. Her expertise in materials science and engineering has led to the development of cutting-edge technologies that have revolutionized the way we harness and utilize energy.

Collaborations: Throughout her career, Ya-Lien Lee has collaborated with top engineers, scientists, and researchers from around the globe. These collaborations have not only enriched her work but have also paved the way for interdisciplinary innovations that have pushed the boundaries of what is possible in the world of technology.

Conclusion: Ya-Lien Lee's passion for innovation, coupled with her relentless drive to make the world a better place, has solidified her position as a trailblazer in the field of renewable energy technologies. Her work continues to inspire future generations of inventors to think boldly and act decisively in the pursuit of a more sustainable and technologically advanced world.

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