The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
May. 27, 2022
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Jen-Chun Wang, Chiayi, TW;
Ya-Lien Lee, Baoshan Township, TW;
Chih-Chien Chi, Hsinchu, TW;
Hung-Wen Su, Jhubei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/35 (2006.01); H01L 21/768 (2006.01); H01J 37/34 (2006.01); C23C 14/00 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); C23C 14/06 (2006.01); C23C 14/22 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); C23C 14/34 (2006.01); H01L 21/285 (2006.01); C23C 14/04 (2006.01); C23C 16/04 (2006.01); H01L 21/3205 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
C23C 14/35 (2013.01); C23C 14/0036 (2013.01); C23C 14/046 (2013.01); C23C 14/0641 (2013.01); C23C 14/225 (2013.01); C23C 14/3492 (2013.01); C23C 14/358 (2013.01); C23C 16/045 (2013.01); C23C 16/34 (2013.01); C23C 16/45525 (2013.01); H01J 37/3405 (2013.01); H01J 37/3458 (2013.01); H01L 21/02183 (2013.01); H01L 21/02266 (2013.01); H01L 21/2855 (2013.01); H01L 21/67253 (2013.01); H01L 21/76831 (2013.01); H01L 21/76843 (2013.01); H01L 21/28568 (2013.01); H01L 21/32051 (2013.01); H01L 23/53238 (2013.01);
Abstract
A semiconductor device is manufactured by modifying an electromagnetic field within a deposition chamber. In embodiments in which the deposition process is a sputtering process, the electromagnetic field may be modified by adjusting a distance between a first coil and a mounting platform. In other embodiments, the electromagnetic field may be adjusted by applying or removing power from additional coils that are also present.