Hung-Wen Su

This inventor holds 98 USPTO granted patents and 17 published patent applications, primarily in Semiconductor Interconnects (CPC class H01L23-53238). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2004-2026.

USPTO Granted Patents = 98 (Patent Applications = 17)

% Patents Active = 76.5

Average Co-Inventor Count = 4.2

ph-index = 9

Forward Citations = 650(Granted Patents)

Forward Citations (Not Self Cited) = 573(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Jubei, TW (2004 - 2006)
Jabei, TW (2006)
Zhubei, TW (2017)
Chupei, TW (2018)
Hsinchu County, TW (2015 - 2021)
Hsinchu, TW (2007 - 2024)
Jhubei, TW (2007 - 2024)

Company Filing History:

96 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 463

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2004-2026

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Areas of Expertise:

Metal Cap

Interconnect Structure

Conductive Structures

Barrier Layer

Copper-Alloy Adhesion

Multi-Layer Film

Contact Structure

Chemical Plating

Thermally Stable

Physical Vapor Deposition

Graphite Inclusion

Diffusion Barrier

98 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12751270 - Diffusion barrier for semiconductor device and method (2026-09-29),

2. 12685132 - Aluminum structures (2026-07-14),

3. 12581925 - Selective metal cap in an interconnect structure (2026-03-17),

4. 12557629 - Interconnect structure and methods of forming the same (2026-02-17),

5. 12469745 - Conductive structures with bottom-less barriers and liners (2025-11-11),

6. 12334397 - Interconnect structure including graphite and method forming same (2025-06-17),

7. 12322649 - Interconnect structure of semiconductor device (2025-06-03),

8. 12315809 - Via for semiconductor device and method (2025-05-27),

9. 12237261 - Semiconductor device having a contact structure (2025-02-25),

10. 12166128 - Multi-layer film device and method (2024-12-10),

11. 12165975 - Method of forming interconnect structure having a barrier layer (2024-12-10),

12. 12159838 - Method of forming an interconnect structure having an air gap and structure thereof (2024-12-03),

13. 12159837 - Chemical direct pattern plating method (2024-12-03),

14. 12094770 - Ruthenium-based liner for a copper interconnect (2024-09-17),

15. 12080594 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2024-09-03),

Title: The Innovative Journey of Inventor Hung-Wen Su

Introduction: Hung-Wen Su, a talented inventor hailing from Jhubei, Taiwan, has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Hung-Wen Su's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: Throughout his career, Hung-Wen Su has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His work has led to the creation of several cutting-edge solutions that have revolutionized the industry.

Collaborations: Hung-Wen Su has collaborated with leading research institutions and technology companies to bring his inventions to life. His ability to work effectively in a team setting has been instrumental in the success of many projects.

Conclusion: Hung-Wen Su's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His contributions continue to inspire and shape the future of the industry.