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For the Inventor, By the Inventor

Jhubei, Taiwan

Hung-Wen Su

This inventor holds 98 USPTO granted patents and 18 published patent applications, primarily in Semiconductor Interconnects (CPC class H01L23-53238). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hung-Wen Su. Retrieved from https://idiyas.com/inventor/hung-wen-su

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 98 

% Patents Active = 76.5

Average Co-Inventor Count = 4.2

ph-index = 9

Forward Citations = 650(Granted Patents)

Forward Citations (Not Self Cited) = 573(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Jubei, TW (2004 - 2006)
  • Jabei, TW (2006)
  • Zhubei, TW (2017)
  • Chupei, TW (2018)
  • Hsinchu County, TW (2015 - 2021)
  • Hsinchu, TW (2007 - 2024)
  • Jhubei, TW (2007 - 2024)

Company Filing History:

goldMedal96 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2004-2026

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Areas of Expertise:
Metal Cap
Interconnect Structure
Conductive Structures
Barrier Layer
Copper-Alloy Adhesion
Multi-Layer Film
Contact Structure
Chemical Plating
Thermally Stable
Physical Vapor Deposition
Graphite Inclusion
Diffusion Barrier
98 patents (USPTO):Explore Patents
1. 12751270 - Diffusion barrier for semiconductor device and method (2026-09-29),
2. 12685132 - Aluminum structures (2026-07-14),
3. 12581925 - Selective metal cap in an interconnect structure (2026-03-17),
4. 12557629 - Interconnect structure and methods of forming the same (2026-02-17),
5. 12469745 - Conductive structures with bottom-less barriers and liners (2025-11-11),
6. 12334397 - Interconnect structure including graphite and method forming same (2025-06-17),
7. 12322649 - Interconnect structure of semiconductor device (2025-06-03),
8. 12315809 - Via for semiconductor device and method (2025-05-27),
9. 12237261 - Semiconductor device having a contact structure (2025-02-25),
10. 12166128 - Multi-layer film device and method (2024-12-10),
11. 12165975 - Method of forming interconnect structure having a barrier layer (2024-12-10),
12. 12159838 - Method of forming an interconnect structure having an air gap and structure thereof (2024-12-03),
13. 12159837 - Chemical direct pattern plating method (2024-12-03),
14. 12094770 - Ruthenium-based liner for a copper interconnect (2024-09-17),
15. 12080594 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2024-09-03),

Title: The Innovative Journey of Inventor Hung-Wen Su

Introduction: Hung-Wen Su, a talented inventor hailing from Jhubei, Taiwan, has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Hung-Wen Su's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: Throughout his career, Hung-Wen Su has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His work has led to the creation of several cutting-edge solutions that have revolutionized the industry.

Collaborations: Hung-Wen Su has collaborated with leading research institutions and technology companies to bring his inventions to life. His ability to work effectively in a team setting has been instrumental in the success of many projects.

Conclusion: Hung-Wen Su's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His contributions continue to inspire and shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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