The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Aug. 30, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yao-Min Liu, Taipei, TW;
Ming-Yuan Gao, Hsinchu, TW;
Ming-Chou Chiang, Taichung, TW;
Shu-Cheng Chin, Hsinchu, TW;
Huei-Wen Hsieh, Hsinchu, TW;
Kai-Shiang Kuo, Hsinchu, TW;
Yen-Chun Lin, Hsinchu, TW;
Cheng-Hui Weng, Hsinchu, TW;
Chun-Chieh Lin, Taichung, TW;
Hung-Wen Su, Jhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
In some implementations, one or more semiconductor processing tools may form a via within a substrate of a semiconductor device. The one or more semiconductor processing tools may deposit a ruthenium-based liner within the via. The one or more semiconductor processing tools may deposit, after depositing the ruthenium-based liner, a copper plug within the via.