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For the Inventor, By the Inventor

Hsinchu, Taiwan

Cheng-Hui Weng

USPTO Granted Patents = 10 

Average Co-Inventor Count = 4.9

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:

goldMedal10 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

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10 patents (USPTO):Explore Patents
1. 12354910 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2025-07-08),
2. 12347728 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2025-07-01),
3. 12322649 - Interconnect structure of semiconductor device (2025-06-03),
4. 12094770 - Ruthenium-based liner for a copper interconnect (2024-09-17),
5. 12080594 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2024-09-03),
6. 11854878 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2023-12-26),
7. 11676898 - Diffusion barrier for semiconductor device and method (2023-06-13),
8. 11430692 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2022-08-30),
9. 8951909 - Integrated circuit structure and formation (2015-02-10),
10. 8367545 - System and method for monitoring copper barrier layer preclean process (2013-02-05),

Title: The Innovative Journey of Cheng-Hui Weng

Introduction: Cheng-Hui Weng, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Cheng-Hui Weng's latest patents focus on advancements in semiconductor technology, particularly in the development of energy-efficient microchips for various electronic devices.

Career Highlights: With a career spanning over two decades, Cheng-Hui Weng has worked with leading tech companies in Taiwan, honing his skills in research and development. His expertise lies in the areas of nanotechnology and semiconductor engineering.

Collaborations: Throughout his career, Cheng-Hui Weng has collaborated with top research institutions and universities in Taiwan, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have led to the successful development of cutting-edge technologies.

Conclusion: Cheng-Hui Weng's passion for innovation and his dedication to pushing the boundaries of technology have solidified his reputation as a pioneering inventor in the field of semiconductor engineering. His contributions continue to inspire the next generation of inventors and researchers worldwide.

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