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For the Inventor, By the Inventor

Hsinchu, Taiwan

Cheng-Hui Weng

This inventor holds 12 USPTO granted patents and 9 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Hui Weng. Retrieved from https://idiyas.com/inventor/cheng-hui-weng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 83.3

Average Co-Inventor Count = 5.1

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal11 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 491 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2013-2026

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12 patents (USPTO):Explore Patents
1. 12751270 - Diffusion barrier for semiconductor device and method (2026-09-29),
2. 12557629 - Interconnect structure and methods of forming the same (2026-02-17),
3. 12354910 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2025-07-08),
4. 12347728 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2025-07-01),
5. 12322649 - Interconnect structure of semiconductor device (2025-06-03),
6. 12094770 - Ruthenium-based liner for a copper interconnect (2024-09-17),
7. 12080594 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2024-09-03),
8. 11854878 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2023-12-26),
9. 11676898 - Diffusion barrier for semiconductor device and method (2023-06-13),
10. 11430692 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2022-08-30),
11. 8951909 - Integrated circuit structure and formation (2015-02-10),
12. 8367545 - System and method for monitoring copper barrier layer preclean process (2013-02-05),

Title: The Innovative Journey of Cheng-Hui Weng

Introduction: Cheng-Hui Weng, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Cheng-Hui Weng's latest patents focus on advancements in semiconductor technology, particularly in the development of energy-efficient microchips for various electronic devices.

Career Highlights: With a career spanning over two decades, Cheng-Hui Weng has worked with leading tech companies in Taiwan, honing his skills in research and development. His expertise lies in the areas of nanotechnology and semiconductor engineering.

Collaborations: Throughout his career, Cheng-Hui Weng has collaborated with top research institutions and universities in Taiwan, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have led to the successful development of cutting-edge technologies.

Conclusion: Cheng-Hui Weng's passion for innovation and his dedication to pushing the boundaries of technology have solidified his reputation as a pioneering inventor in the field of semiconductor engineering. His contributions continue to inspire the next generation of inventors and researchers worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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