logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

Shu-Cheng Chin

This inventor holds 16 USPTO granted patents and 21 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shu-Cheng Chin. Retrieved from https://idiyas.com/inventor/shu-cheng-chin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal16 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2023-2026

Loading Chart...
16 patents (USPTO):Explore Patents
1. 12685133 - Ruthenium oxide film and ruthenium liner for low-resistance copper interconnects in a device (2026-07-14),
2. 12557631 - Low-resistance copper interconnects (2026-02-17),
3. 12469745 - Conductive structures with bottom-less barriers and liners (2025-11-11),
4. 12394717 - Graphite-based interconnects and methods of fabrication thereof (2025-08-19),
5. 12354958 - Semiconductor devices and methods of formation (2025-07-08),
6. 12334397 - Interconnect structure including graphite and method forming same (2025-06-17),
7. 12322649 - Interconnect structure of semiconductor device (2025-06-03),
8. 12315764 - Conductive structures with barriers and liners of varying thicknesses (2025-05-27),
9. 12255144 - Graphene liners and caps for semiconductor structures (2025-03-18),
10. 12237261 - Semiconductor device having a contact structure (2025-02-25),
11. 12165975 - Method of forming interconnect structure having a barrier layer (2024-12-10),
12. 12094770 - Ruthenium-based liner for a copper interconnect (2024-09-17),
13. 11996361 - Method of making a contact structure (2024-05-28),
14. 11749604 - Ruthenium oxide film and ruthenium liner for low-resistance copper interconnects in a device (2023-09-05),
15. 11742290 - Interconnect structure and method of forming thereof (2023-08-29),

Title: The Innovative Journey of Shu-Cheng Chin

Introduction: Shu-Cheng Chin, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Shu-Cheng Chin's latest patents include advancements in semiconductor technology, particularly in the development of next-generation microchips with enhanced processing capabilities.

Career Highlights: With a career spanning over two decades, Shu-Cheng Chin has worked with leading tech companies in Taiwan, spearheading research and development projects that have pushed the boundaries of technological innovation.

Collaborations: Throughout his career, Shu-Cheng Chin has collaborated with top researchers and engineers in the industry, fostering a culture of innovation and knowledge sharing that has led to the successful implementation of cutting-edge technologies.

Conclusion: Shu-Cheng Chin's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his reputation as a visionary inventor in the field of semiconductor technology. His contributions continue to inspire future generations of inventors and researchers in Taiwan and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…