The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Jul. 21, 2021
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Shu-Cheng Chin, Hsinchu, TW;

Chih-Yi Chang, New Taipei, TW;

Wei Hsiang Chan, Hsinchu, TW;

Chih-Chien Chi, Hsinchu, TW;

Chi-Feng Lin, Hsinchu, TW;

Hung-Wen Su, Jhubei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/3105 (2006.01); H01L 21/3213 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76885 (2013.01); H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H01L 21/7684 (2013.01); H01L 23/5226 (2013.01); H01L 23/53276 (2013.01); H01L 21/31053 (2013.01); H01L 21/32136 (2013.01); H01L 23/53238 (2013.01);
Abstract

A method includes forming a first conductive feature, depositing a graphite layer over the first conductive feature, patterning the graphite layer to form a graphite conductive feature, depositing a dielectric spacer layer on the graphite layer, depositing a first dielectric layer over the dielectric spacer layer, planarizing the first dielectric layer, forming a second dielectric layer over the first dielectric layer, and forming a second conductive feature in the second dielectric layer. The second conductive feature is over and electrically connected to the graphite conductive feature.


Find Patent Forward Citations

Loading…