Chi-Feng Lin

This inventor holds 19 USPTO granted patents and 19 published patent applications, primarily in Semiconductor Structures. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Mediatek Corporation. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chi-Feng Lin. Retrieved from https://idiyas.com/inventor/chi-feng-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 19 (Patent Applications = 19)

% Patents Active = 94.7

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 11(Granted Patents)

Company Filing History:

15 out of 42,965

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2014-2026

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Areas of Expertise:

Aluminum Structures

Copper Interconnects

Conductive Structures

Semiconductor Device

Interconnect Structure

Barriers and Liners

Manganese Diffusion

Graphite Inclusion

Data Transmission

Cyclic Redundancy Check

Conductor Patterns

Network Device

19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12685132 - Aluminum structures (2026-07-14),

2. 12660582 - Self-aligned interconnect structure and method of forming the same (2026-06-16),

3. 12557631 - Low-resistance copper interconnects (2026-02-17),

4. 12469745 - Conductive structures with bottom-less barriers and liners (2025-11-11),

5. 12341101 - Method for forming a semiconductor structure by diffusing manganese from a seed layer to a barrier layer (2025-06-24),

6. 12334397 - Interconnect structure including graphite and method forming same (2025-06-17),

7. 12315764 - Conductive structures with barriers and liners of varying thicknesses (2025-05-27),

8. 12237261 - Semiconductor device having a contact structure (2025-02-25),

9. 12165975 - Method of forming interconnect structure having a barrier layer (2024-12-10),

10. 11996361 - Method of making a contact structure (2024-05-28),

11. 11742290 - Interconnect structure and method of forming thereof (2023-08-29),

12. 11652044 - Contact structure and method of making (2023-05-16),

13. 9998575 - Network device and method for outputting data to bus with data bus width at each cycle by generating end of packet and start of packet at different cycles (2018-06-12),

14. 9787434 - Cyclic redundancy check device and method (2017-10-10),

15. 9628396 - Network device and method for outputting data to bus with data bus width at each cycle by generating end of packet and start of packet at different cycles (2017-04-18),

Title: The Innovative Journey of Inventor Chi-Feng Lin

Introduction: Chi-Feng Lin, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Chi-Feng Lin's most recent patents include advancements in semiconductor technology, renewable energy systems, and artificial intelligence algorithms, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Chi-Feng Lin has held key positions in leading tech companies, where he spearheaded research and development projects that have led to numerous successful patent applications. His expertise in areas such as nanotechnology and telecommunications has earned him recognition as a thought leader in the industry.

Collaborations: Throughout his career, Chi-Feng Lin has collaborated with top research institutions, universities, and multinational corporations to drive innovation and bring cutting-edge technologies to the market. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: Chi-Feng Lin's passion for innovation, coupled with his technical acumen and collaborative spirit, continues to inspire the next generation of inventors and researchers. His dedication to pushing the boundaries of technology underscores his status as a true visionary in the world of inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

19 patents pending: