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For the Inventor, By the Inventor

Hsinchu, Taiwan

Huei-Wen Hsieh

This inventor holds 9 USPTO granted patents and 4 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Huei-Wen Hsieh. Retrieved from https://idiyas.com/inventor/huei-wen-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 9 

% Patents Active = 88.9

Average Co-Inventor Count = 6.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal8 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 503 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2022-2026

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9 patents (USPTO):Explore Patents
1. 12575344 - Interconnect structures and methods and apparatuses for forming the same (2026-03-10),
2. 12400862 - Interconnect structures and methods and apparatuses for forming the same (2025-08-26),
3. 12354910 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2025-07-08),
4. 12347728 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2025-07-01),
5. 12094770 - Ruthenium-based liner for a copper interconnect (2024-09-17),
6. 12080594 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2024-09-03),
7. 11854878 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2023-12-26),
8. 11694899 - Interconnect structures and methods and apparatuses for forming the same (2023-07-04),
9. 11430692 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2022-08-30),

Title: The Innovative Journey of Inventor Huei-Wen Hsieh

Introduction:

Huei-Wen Hsieh, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Huei-Wen Hsieh holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and creativity.

Career Highlights:

Throughout his illustrious career, Hsieh has worked with leading tech companies and research institutions, spearheading projects that have pushed the boundaries of innovation. His keen eye for detail and passion for problem-solving have led to the development of cutting-edge solutions that have revolutionized various industries.

Collaborations:

Huei-Wen Hsieh has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the creation of groundbreaking technologies that have had a lasting impact on society.

Conclusion:

Inventor Huei-Wen Hsieh's relentless pursuit of innovation and his unwavering commitment to excellence have solidified his reputation as a visionary in the world of technology. His remarkable achievements continue to inspire the next generation of inventors and pave the way for a future filled with endless possibilities.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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