Growing community of inventors

Hsinchu, Taiwan

Huei-Wen Hsieh

Average Co-Inventor Count = 6.47

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 1

Huei-Wen HsiehChun-Sheng Chen (7 patents)Huei-Wen HsiehKai-Shiang Kuo (6 patents)Huei-Wen HsiehCheng-Hui Weng (6 patents)Huei-Wen HsiehHung-Wen Su (3 patents)Huei-Wen HsiehChun-Chieh Lin (3 patents)Huei-Wen HsiehWen-Hsuan Chen (3 patents)Huei-Wen HsiehKuan-Chia Chen (2 patents)Huei-Wen HsiehNai-Hao Yang (2 patents)Huei-Wen HsiehCheng-Lun Tsai (2 patents)Huei-Wen HsiehYu-Cheng Hsiao (2 patents)Huei-Wen HsiehChe-Wei Tien (2 patents)Huei-Wen HsiehJen-Wei Liu (2 patents)Huei-Wen HsiehChun-Hsu Yang (2 patents)Huei-Wen HsiehYen-Chun Lin (1 patent)Huei-Wen HsiehShu-Cheng Chin (1 patent)Huei-Wen HsiehYao-Min Liu (1 patent)Huei-Wen HsiehMing-Yuan Gao (1 patent)Huei-Wen HsiehMing-Chou Chiang (1 patent)Huei-Wen HsiehHuei-Wen Hsieh (8 patents)Chun-Sheng ChenChun-Sheng Chen (9 patents)Kai-Shiang KuoKai-Shiang Kuo (17 patents)Cheng-Hui WengCheng-Hui Weng (10 patents)Hung-Wen SuHung-Wen Su (94 patents)Chun-Chieh LinChun-Chieh Lin (81 patents)Wen-Hsuan ChenWen-Hsuan Chen (4 patents)Kuan-Chia ChenKuan-Chia Chen (9 patents)Nai-Hao YangNai-Hao Yang (5 patents)Cheng-Lun TsaiCheng-Lun Tsai (4 patents)Yu-Cheng HsiaoYu-Cheng Hsiao (4 patents)Che-Wei TienChe-Wei Tien (2 patents)Jen-Wei LiuJen-Wei Liu (2 patents)Chun-Hsu YangChun-Hsu Yang (2 patents)Yen-Chun LinYen-Chun Lin (18 patents)Shu-Cheng ChinShu-Cheng Chin (14 patents)Yao-Min LiuYao-Min Liu (9 patents)Ming-Yuan GaoMing-Yuan Gao (4 patents)Ming-Chou ChiangMing-Chou Chiang (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Taiwan Semiconductor Manufacturing Comp. Ltd. (8 from 40,635 patents)


8 patents:

1. 12400862 - Interconnect structures and methods and apparatuses for forming the same

2. 12354910 - Bi-layer alloy liner for interconnect metallization and methods of forming the same

3. 12347728 - Bi-layer alloy liner for interconnect metallization and methods of forming the same

4. 12094770 - Ruthenium-based liner for a copper interconnect

5. 12080594 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same

6. 11854878 - Bi-layer alloy liner for interconnect metallization and methods of forming the same

7. 11694899 - Interconnect structures and methods and apparatuses for forming the same

8. 11430692 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same

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12/4/2025
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