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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ming-Yuan Gao

USPTO Granted Patents = 4 

Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal4 out of 40,850 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2023-2025

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4 patents (USPTO):Explore Patents
1. 12469745 - Conductive structures with bottom-less barriers and liners (2025-11-11),
2. 12165975 - Method of forming interconnect structure having a barrier layer (2024-12-10),
3. 12094770 - Ruthenium-based liner for a copper interconnect (2024-09-17),
4. 11742290 - Interconnect structure and method of forming thereof (2023-08-29),

Title: The Innovative Journey of Ming-Yuan Gao

Introduction:

Ming-Yuan Gao, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents:

Ming-Yuan Gao's latest patents focus on cutting-edge advancements in semiconductor technology, artificial intelligence, and renewable energy solutions.

Career Highlights:

With a career spanning over two decades, Ming-Yuan Gao has held key positions in renowned tech companies, leading groundbreaking projects and driving innovation in the industry.

Collaborations:

Throughout his career, Ming-Yuan Gao has collaborated with top research institutions, universities, and multinational corporations to push the boundaries of technological innovation and bring revolutionary ideas to life.

Conclusion:

In conclusion, Ming-Yuan Gao's relentless pursuit of innovation and his passion for creating impactful solutions have solidified his position as a trailblazer in the world of technology.

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