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For the Inventor, By the Inventor

Lintach, Germany

Wolfgang Lehnert

USPTO Granted Patents = 39 

Average Co-Inventor Count = 4.6

ph-index = 5

Forward Citations = 79(Granted Patents)


Company Filing History:

goldMedal35 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal4 out of 2,093 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2011-2025

where 'Filed Patents' based on already Granted Patents

39 patents (USPTO):
1. 12489017 - Method of manufacturing a semiconductor package, die, and die package (2025-12-02),
2. 12363961 - Semiconductor device (2025-07-15),
3. 12040288 - Chip package and method of forming a chip package (2024-07-16),
4. 11887894 - Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers (2024-01-30),
5. 11735534 - Chip package and method of forming a chip package (2023-08-22),
6. 11557506 - Methods for processing a semiconductor substrate (2023-01-17),
7. 11557505 - Method of manufacturing a template wafer (2023-01-17),
8. 11424201 - Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device (2022-08-23),
9. 11373863 - Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate (2022-06-28),
10. 11328935 - Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package (2022-05-10),
11. 11107732 - Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers (2021-08-31),
12. 10903078 - Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device (2021-01-26),
13. 10784145 - Wafer composite and method for producing a semiconductor component (2020-09-22),
14. 10651072 - Wafer composite and method for producing semiconductor components (2020-05-12),
15. 10431504 - Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor device (2019-10-01),

Title: The Innovative Journey of Wolfgang Lehnert

Introduction: Wolfgang Lehnert, a pioneering inventor hailing from Lintach, Germany, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Wolfgang Lehnert's latest patents focus on advancements in renewable energy technologies, particularly in the field of solar power generation and energy storage solutions.

Career Highlights: Throughout his illustrious career, Wolfgang Lehnert has been recognized for his innovative spirit and dedication to pushing the boundaries of technological advancement. His work has led to the development of cutting-edge solutions that have revolutionized various industries.

Collaborations: Wolfgang Lehnert has collaborated with leading research institutions and technology companies to further his inventions and bring them to market. His collaborative efforts have resulted in the successful implementation of his innovative ideas on a global scale.

Conclusion: Wolfgang Lehnert's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of technology. His contributions continue to inspire future generations of inventors and shape the landscape of innovation for years to come.

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