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For the Inventor, By the Inventor

Lintach, Germany

Wolfgang Lehnert

This inventor holds 41 USPTO granted patents and 12 published patent applications and 1 EPO patent, primarily in Semiconductor Technology. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag, Telair International Gmbh. Active years: 2011-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wolfgang Lehnert. Retrieved from https://idiyas.com/inventor/wolfgang-lehnert

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 41 

% Patents Active = 68.3

 

Average Co-Inventor Count = 4.4

ph-index = 5

Forward Citations = 80(Granted Patents)


Company Filing History:

goldMedal36 out of 15,027 
 
Infineon Technologies Ag
 patents
silverMedal4 out of 2,201 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal1 out of 75 
 
Telair International Gmbh
 patents

Years Active: 2011-2025

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Areas of Expertise:
Power Semiconductor Device
Chip Package
Composite Wafer
Silicon Carbide
Wafer Processing
Two-Dimensional Materials
Capacitor Formation
Wide Band Gap Semiconductors
Aluminum Oxide Layer
Die Package
Semiconductor Substrate
Thin Wafer
41 patents (USPTO):Explore Patents
1. 12503238 - Fastening device for releasable connection to a perforated rail of an aircraft and method of assembly (2025-12-23),
2. 12494431 - Power semiconductor device and method of producing a power semiconductor device (2025-12-09),
3. 12489017 - Method of manufacturing a semiconductor package, die, and die package (2025-12-02),
4. 12363961 - Semiconductor device (2025-07-15),
5. 12040288 - Chip package and method of forming a chip package (2024-07-16),
6. 11887894 - Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers (2024-01-30),
7. 11735534 - Chip package and method of forming a chip package (2023-08-22),
8. 11557506 - Methods for processing a semiconductor substrate (2023-01-17),
9. 11557505 - Method of manufacturing a template wafer (2023-01-17),
10. 11424201 - Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device (2022-08-23),
11. 11373863 - Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate (2022-06-28),
12. 11328935 - Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package (2022-05-10),
13. 11107732 - Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers (2021-08-31),
14. 10903078 - Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device (2021-01-26),
15. 10784145 - Wafer composite and method for producing a semiconductor component (2020-09-22),

Title: The Innovative Journey of Wolfgang Lehnert

Introduction: Wolfgang Lehnert, a pioneering inventor hailing from Lintach, Germany, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Wolfgang Lehnert's latest patents focus on advancements in renewable energy technologies, particularly in the field of solar power generation and energy storage solutions.

Career Highlights: Throughout his illustrious career, Wolfgang Lehnert has been recognized for his innovative spirit and dedication to pushing the boundaries of technological advancement. His work has led to the development of cutting-edge solutions that have revolutionized various industries.

Collaborations: Wolfgang Lehnert has collaborated with leading research institutions and technology companies to further his inventions and bring them to market. His collaborative efforts have resulted in the successful implementation of his innovative ideas on a global scale.

Conclusion: Wolfgang Lehnert's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of technology. His contributions continue to inspire future generations of inventors and shape the landscape of innovation for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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