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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12489017 B1

PDFFull Text
Date of Patent:
Dec. 02, 2025

Filed:

Jan. 13, 2022

Method of manufacturing a semiconductor package, die, and die package

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Fabian Craes, Soest, DE;

Wolfgang Lehnert, Lintach, DE;

Maik Lohmann, Soest, DE;

Harry Walter Sax, Straubing, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Dicke, Billig & Czaja, PLLC

Primary Examiner:

Mohammad M Choudhry

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/291 (2013.01); H01L 23/3171 (2013.01); H01L 24/48 (2013.01); H01L 2224/48225 (2013.01);
Abstract

A method of manufacturing a semiconductor package is provided. The method may include singulating a wafer including a plurality of dies fixed to an auxiliary carrier to generate dies having released side surfaces, covering at least the side surfaces of the dies with a passivation layer using a deposition process at a temperature below the melting temperature of the auxiliary carrier, keeping a gap between the passivation layers at the side surfaces of adjacent dies of the plurality of dies.

Find Patent Forward Citations

Craes, Fabian. (2025). Method of manufacturing a semiconductor package, die, and die package (U.S. Patent No. 12489017). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12489017

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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