Maik Lohmann

Title: Maik Lohmann: Innovator in Semiconductor Packaging

Introduction

Maik Lohmann is a prominent inventor based in Soest, Germany. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative methods and techniques. His work is particularly recognized for its impact on the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Maik Lohmann holds a patent for a "Method of manufacturing a semiconductor package, die, and die package." This method involves singulating a wafer that contains multiple dies fixed to an auxiliary carrier. The process generates dies with released side surfaces and includes covering these surfaces with a passivation layer using a deposition process at a temperature below the melting point of the auxiliary carrier. This innovative approach maintains a gap between the passivation layers of adjacent dies, enhancing the overall performance of semiconductor packages. He has 1 patent to his name.

Career Highlights

Lohmann is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role at Infineon has allowed him to further develop his skills and contribute to cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing manufacturing techniques that improve product reliability and performance.

Collaborations

Throughout his career, Maik has collaborated with notable colleagues, including Fabian Craes and Wolfgang Lehnert. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas, leading to advancements in semiconductor technology.

Conclusion

Maik Lohmann is a key figure in the semiconductor industry, known for his innovative methods in packaging technology. His contributions continue to shape the future of semiconductor manufacturing, making him a valuable asset to Infineon Technologies AG and the broader field.