The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Aug. 22, 2023
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Harry Walter Sax, Straubing, DE;
Johann Gatterbauer, Parsberg, DE;
Wolfgang Lehnert, Lintach, DE;
Evelyn Napetschnig, Diex, AT;
Michael Rogalli, Rottenburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/56 (2013.01); H01L 23/3142 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/0382 (2013.01); H01L 2224/05687 (2013.01); H01L 2924/365 (2013.01);
Abstract
A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.