Werner Robl

This inventor holds 26 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Fabrication. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag, International Business Machines Corporation. Active years: 2004-2026.

USPTO Granted Patents = 26 (Patent Applications = 4)

% Patents Active = 76.9

Average Co-Inventor Count = 5.3

ph-index = 5

Forward Citations = 118(Granted Patents)

Location History:

Poughkeepsie, NY (US) (2004 - 2005)
Regensburg, DE (2011 - 2023)

Company Filing History:

22 out of 15,023

Infineon Technologies Ag

patents

3 out of 2,196

Infineon Technologies Austria Ag

patents

1 out of 166,325

International Business Machines Corporation

patents

4. 1 out of 834,453

Other

patents

where one patent can have more than one assignee

Years Active: 2004-2026

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Areas of Expertise:

Electroplating

Semiconductor Device

Integrated Circuit

Metallization Layer

Copper Element

Barrier Layer

Heat Sink Structure

Coreless Transformer

Chip Fabrication

Particle Deposition

Bond Pad Structure

Aluminum Deposition

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12543509 - Fabrication of electroplated nickel-iron layers with titanium-copper seed layer (2026-02-03),

2. 11615963 - Electronic device, electronic module and methods for fabricating the same (2023-03-28),

3. 11276624 - Semiconductor device power metallization layer with stress-relieving heat sink structure (2022-03-15),

4. 11171049 - Semiconductor device and a method of forming the semiconductor device (2021-11-09),

5. 10741402 - Electronic device, electronic module and methods for fabricating the same (2020-08-11),

6. 10648096 - Electrolyte, method of forming a copper layer and method of forming a chip (2020-05-12),

7. 10446469 - Semiconductor device having a copper element and method of forming a semiconductor device having a copper element (2019-10-15),

8. 10332793 - Self-organizing barrier layer disposed between a metallization layer and a semiconductor region (2019-06-25),

9. 9425146 - Semiconductor structure and method for making same (2016-08-23),

10. 9418937 - Integrated circuit and method of forming an integrated circuit (2016-08-16),

11. 8786085 - Semiconductor structure and method for making same (2014-07-22),

12. 8759207 - Semiconductor structure and method for making same (2014-06-24),

13. 8665054 - Semiconductor component with coreless transformer (2014-03-04),

14. 8338317 - Method for processing a semiconductor wafer or die, and particle deposition device (2012-12-25),

15. 8334202 - Device fabricated using an electroplating process (2012-12-18),

Title: Werner Robl - Innovative Inventor from Wuppertal

Introduction: Werner Robl is a renowned inventor hailing from Wuppertal, Germany, known for his groundbreaking contributions to various fields of technology and innovation.

Latest Patents: Werner Robl holds several patents in the areas of renewable energy, sustainable transportation, and advanced materials, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Werner Robl has worked with leading research institutions and companies to develop cutting-edge technologies that have revolutionized industries worldwide.

Collaborations: Throughout his career, Werner Robl has collaborated with top engineers, scientists, and inventors, fostering a culture of innovation and excellence in all his projects.

Conclusion: Werner Robl's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.