The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2012
Filed:
Nov. 03, 2009
Jens Pohl, Bernhardswald, DE;
Hans-joachim Barth, Munich, DE;
Gottfried Beer, Nittendorf, DE;
Rainer Steiner, Regensburg, DE;
Werner Robl, Regensburg, DE;
Mathias Vaupel, Regensburg, DE;
Jens Pohl, Bernhardswald, DE;
Hans-Joachim Barth, Munich, DE;
Gottfried Beer, Nittendorf, DE;
Rainer Steiner, Regensburg, DE;
Werner Robl, Regensburg, DE;
Mathias Vaupel, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method for fabricating a device includes providing a substrate including at least one contact and applying a dielectric layer over the substrate. The method includes applying a first seed layer over the dielectric layer, applying an inert layer over the seed layer, and structuring the inert layer, the first seed layer, and the dielectric layer to expose at least a portion of the contact. The method includes applying a second seed layer over exposed portions of the structured dielectric layer and the contact such that the second seed layer makes electrical contact with the structured first seed layer. The method includes electroplating a metal on the second seed layer.