The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
May. 07, 2019
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Werner Robl, Regensburg, DE;
Michael Fugger, Vienna, AT;
Carsten Schaeffer, Annenheim, AT;
Michael Nelhiebel, Villach, AT;
Klemens Pruegl, Regensburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76868 (2013.01); H01L 21/28518 (2013.01); H01L 21/76843 (2013.01); H01L 21/76864 (2013.01); H01L 21/76867 (2013.01); H01L 21/76886 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01);
Abstract
According to various embodiments, a device may include: a semiconductor region; a metallization layer disposed over the semiconductor region; and a self-organizing barrier layer disposed between the metallization layer and the semiconductor region, wherein the self-organizing barrier layer comprises a first metal configured to be self-segregating from the metallization layer.