The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Jul. 22, 2016
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Thomas Detzel, Villach, AT;
Johann Gross, Neutraubling, DE;
Robert Illing, Villach, AT;
Maximilian Krug, Zeitlarn, DE;
Sven Gustav Lanzerstorfer, Feldkirchen, AT;
Michael Nelhiebel, Villach, AT;
Werner Robl, Regensburg, DE;
Michael Rogalli, Rottenburg, DE;
Stefan Woehlert, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/532 (2006.01); H01L 21/288 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 21/2885 (2013.01); H01L 21/4882 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device includes a base element and a copper element over the base element. The copper element includes a layer stack having at least two copper layers and at least one intermediate conductive layer of a material different from copper. The at least two copper layers and the at least one intermediate conductive layer are alternately stacked over each other.