The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Dec. 09, 2011
Applicants:

Thomas Detzel, Villach, AT;

Johann Gross, Neutraubling, DE;

Robert Illing, Villach, AT;

Maximilian Krug, Zeitlarn, DE;

Sven Gustav Lanzerstorfer, Feldkirchen, AT;

Michael Nelhiebel, Villach, AT;

Werner Robl, Regensburg, DE;

Michael Rogalli, Rottenburg, DE;

Stefan Woehlert, Villach, AT;

Inventors:

Thomas Detzel, Villach, AT;

Johann Gross, Neutraubling, DE;

Robert Illing, Villach, AT;

Maximilian Krug, Zeitlarn, DE;

Sven Gustav Lanzerstorfer, Feldkirchen, AT;

Michael Nelhiebel, Villach, AT;

Werner Robl, Regensburg, DE;

Michael Rogalli, Rottenburg, DE;

Stefan Woehlert, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/532 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 21/2885 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An integrated circuit includes a base element and a copper element over the base element, the copper element having a thickness of at least 5 μm and a ratio of average grain size to thickness of less than 0.7.


Find Patent Forward Citations

Loading…