Company Filing History:
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Years Active: 2004-2025
Title: The Innovative Contributions of Wen-Kai Wan
Introduction
Wen-Kai Wan is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 15 patents. His work focuses on enhancing the thermal conductivity of semiconductor devices, which is crucial for their performance and reliability.
Latest Patents
Wen-Kai Wan's latest patents include a method of manufacturing a heat dissipation substrate with high thermal conductivity for semiconductor devices. This innovative method provides a base substrate and forms a heat dissipation substrate on it, achieving a thermal conductivity between 200 W/mK and 1200 W/mK. The process further involves forming a device layer on the heat dissipation substrate, which includes a transistor, and subsequently removing the base substrate. Another notable patent describes a semiconductor device that incorporates a heat dissipation substrate with a thermal conductivity greater than 200 W/mK, ensuring efficient heat management in electronic applications.
Career Highlights
Throughout his career, Wen-Kai Wan has worked with leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. and MediaTek Corporation. His experience in these organizations has allowed him to develop and refine his innovative techniques in semiconductor manufacturing.
Collaborations
Wen-Kai Wan has collaborated with notable colleagues such as Chih-Hsiang Yao and Tai-Chun Huang, contributing to advancements in semiconductor technology through teamwork and shared expertise.
Conclusion
Wen-Kai Wan's contributions to the semiconductor industry through his innovative patents and collaborations highlight his role as a key inventor in the field. His work continues to influence the development of more efficient and reliable semiconductor devices.