The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
May. 30, 2003
Applicant:
Inventors:
Chih-Hsiang Yao, Taipei, TW;
Wen-Kai Wan, Hsinchu, TW;
Tai-Chun Huang, Kaohsiung, TW;
Chin-Chiu Hsia, Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing, Co., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A method and a pattern for reducing interconnect failures are described. The method and pattern are used for a multilevel structure of metal/dielectric/metal. At least one assistant pattern is attached to one metal layer of the multilevel structure. A thermal stress gradient resulting from the assistant pattern can collect vacancies of the metal layer, so as to prevent stress-induced voids from generating at the bottom of a via plug which connects the two metal layers.