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Wen-Ching Tsai

This inventor holds 33 USPTO granted patents, primarily in 3D Integrated Circuits. Top assignees: Au Optronics Corporation, Taiwan Semiconductor Manufacturing Comp. Ltd., United Microelectronics Corp.. Active years: 1996-2021.

USPTO Granted Patents = 33

% Patents Active = 93.9

Average Co-Inventor Count = 3.7

ph-index = 8

Forward Citations = 231(Granted Patents)

Location History:

Wujie Township, Yilan County, TW (2008)
Jihsin Village, TW (2008)
Hsinchu County, TW (2009 - 2010)
Yilan County, TW (2009 - 2011)
Hsinchu, TW (1996 - 2021)

Company Filing History:

17 out of 4,577

Au Optronics Corporation

patents

11 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

5 out of 7,260

United Microelectronics Corp.

patents

Years Active: 1996-2021

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Areas of Expertise:

3D Stacked-Chip Package

Chip-on-Wafer Structure

Wafer Bonding Process

Thin Film Transistor

Semiconductor Device Structure

Display Panel Structure

Pixel Structure

Memory Cell

Switching Device

Copper Gate Electrode

Field Effect Transistor

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10971417 - 3D stacked-chip package (2021-04-06),

2. 10535631 - 3D Chip-on-wager-on-substrate structure with via last process (2020-01-14),

3. 10373885 - 3D stacked-chip package (2019-08-06),

4. 10157882 - 3D chip-on-wafer-on-substrate structure with via last process (2018-12-18),

5. 9754918 - 3D chip-on-wafer-on-substrate structure with via last process (2017-09-05),

6. 9711379 - 3D stacked-chip package (2017-07-18),

7. 9698081 - 3D chip-on-wafer-on-substrate structure with via last process (2017-07-04),

8. 9666520 - 3D stacked-chip package (2017-05-30),

9. 9633917 - Three dimensional integrated circuit structure and method of manufacturing the same (2017-04-25),

10. 9613926 - Wafer to wafer bonding process and structures (2017-04-04),

11. 9449837 - 3D chip-on-wafer-on-substrate structure with via last process (2016-09-20),

12. 8760593 - Thin film transistor and method for manufacturing thereof (2014-06-24),

13. 8395149 - Semiconductor device structure and method for manufacturing the same (2013-03-12),

14. 8232591 - Illuminating efficiency-increasable and light-erasable memory (2012-07-31),

15. 8212256 - Pixel structure, display panel, eletro-optical apparatus, and method thererof (2012-07-03),

Title: Inventor Wen-Ching Tsai: Revolutionizing Technology in Hsin-Chu

Introduction: Wen-Ching Tsai is a pioneering inventor based in Hsin-Chu, Taiwan, known for her groundbreaking contributions to the field of technology.

Latest Patents: Tsai's recent patents focus on advancements in semiconductor technology, particularly in the development of energy-efficient microchips for various electronic devices.

Career Highlights: With a career spanning over two decades, Tsai has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to significant technological innovations.

Collaborations: Throughout her career, Tsai has collaborated with top engineers, researchers, and scientists in the industry, fostering a culture of innovation and excellence in all her projects.

Conclusion: Wen-Ching Tsai's relentless pursuit of innovation and her commitment to pushing the boundaries of technology make her a standout figure in the world of inventors, with her work continuing to inspire future generations of innovators.

Profile summary based on public USPTO records.

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