The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Apr. 13, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Disclosed herein is a package comprising a first die, a second die, and an insulating film extending along sidewalls of the first die or the second die. The first die includes a first redistribution layer (RDL) disposed on a first semiconductor substrate and a conductive element in the first RDL. The second die includes a second RDL disposed on a second semiconductor substrate, wherein the first RDL is bonded to the second RDL. The package further includes a via extending from the conductive elements through the first semiconductor substrate and a spacer interposed between the first semiconductor substrate and the via. The first spacer extends from the conductive element through the first semiconductor substrate.