Company Filing History:
Years Active: 2012-2018
Title: Tzung-Han Tan: Innovator in Semiconductor and MEMS Technology
Introduction
Tzung-Han Tan is a notable inventor based in Taipei City, Taiwan. He has made significant contributions to the fields of semiconductor devices and MEMS (Micro-Electro-Mechanical Systems) technology. His innovative approaches aim to enhance the performance and reliability of these technologies.
Latest Patent Applications
Tzung-Han Tan has several latest patent applications that showcase his inventive capabilities. One of his applications is titled "STRUCTURE OF A SEMICONDUCTOR DEVICE HAVING A WAVEGUIDE AND METHOD OF FORMING THE SAME." This application describes a method for forming a semiconductor device structure that includes a waveguide. The process begins with providing a SOI (Silicon-On-Insulator) substrate, which consists of bulk silicon, an insulating layer, and a silicon layer. A device region and a waveguide region are then defined on the substrate. Following this, a protection layer and a patterned shielding layer are created to cover the waveguide region while exposing the device region. The method continues with etching to form a recess, allowing for the formation of an epitaxial silicon layer, ultimately leading to the creation of a semiconductor device that overcomes poor electrical performance issues.
Another application is "MEMS DEVICE WITH A COMPOSITE BACK PLATE ELECTRODE AND METHOD OF MAKING THE SAME." This application outlines a method for fabricating a MEMS device. It involves providing a substrate with both a first and second surface, which includes at least one logic region and one MEMS region. An interlayer material is formed on the first surface within the MEMS region, and the second surface is patterned to create a vent pattern. The interlayer material is designed to protect the substrate during the vent pattern formation, preventing any undercut.
Conclusion
Tzung-Han Tan is an innovative inventor whose work in semiconductor and MEMS technology reflects his commitment to advancing these fields. His latest patent applications demonstrate his ability to address critical challenges in device performance and fabrication methods.