The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2013
Filed:
Oct. 13, 2009
Hui-min Wu, Hsinchu County, TW;
Bang-chiang Lan, Taipei, TW;
Ming-i Wang, Taipei County, TW;
Tzung-i Su, Yun-Lin County, TW;
Chien-hsin Huang, Taichung, TW;
Chao-an Su, Kaohsiung County, TW;
Tzung-han Tan, Taipei, TW;
Min Chen, Taipei County, TW;
Meng-jia Lin, Changhua County, TW;
Hui-Min Wu, Hsinchu County, TW;
Bang-Chiang Lan, Taipei, TW;
Ming-I Wang, Taipei County, TW;
Tzung-I Su, Yun-Lin County, TW;
Chien-Hsin Huang, Taichung, TW;
Chao-An Su, Kaohsiung County, TW;
Tzung-Han Tan, Taipei, TW;
Min Chen, Taipei County, TW;
Meng-Jia Lin, Changhua County, TW;
United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A semiconductor structure is provided. The semiconductor structure includes a substrate, a dielectric layer, a pad structure and a protection structure. The dielectric layer is disposed on the substrate. The pad structure is disposed in the dielectric layer. The pad structure includes a plurality of first metal layers and a plurality of plugs which are electrically connected to each other vertically. There is no contact plug disposed between the pad structure and the substrate. The protection structure is disposed in the dielectric layer and encompasses the pad structure.