IDiyas

For the Inventor, By the Inventor

Taipei County, Taiwan

Ming-I Wang

USPTO Granted Patents = 25 

Average Co-Inventor Count = 5.1

ph-index = 6

Forward Citations = 115(Granted Patents)


Location History:

  • Tucheng, TW (2013)
  • Taipei, TW (2013 - 2014)
  • Taipei County, TW (2010 - 2015)
  • New Taipei, TW (2013 - 2017)

Company Filing History:

goldMedal25 out of 7,074 
 
United Microelectronics Corp.
 patents

Years Active: 2010-2017

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25 patents (USPTO):
1. 9783408 - Structure of MEMS electroacoustic transducer (2017-10-10),
2. 9150407 - Method for fabricating MEMS device with protection rings (2015-10-06),
3. 8798291 - Structure of MEMS electroacoustic transducer and fabricating method thereof (2014-08-05),
4. 8710601 - MEMS structure and method for making the same (2014-04-29),
5. 8642986 - Integrated circuit having microelectromechanical system device and method of fabricating the same (2014-02-04),
6. 8587078 - Integrated circuit and fabricating method thereof (2013-11-19),
7. 8558336 - Semiconductor photodetector structure and the fabrication method thereof (2013-10-15),
8. 8525389 - MEMS device with protection rings (2013-09-03),
9. 8525354 - Bond pad structure and fabricating method thereof (2013-09-03),
10. 8519500 - Image sensor with correcting lens and fabrication thereof (2013-08-27),
11. 8502382 - MEMS and protection structure thereof (2013-08-06),
12. 8493661 - Contiguous microlens array (2013-07-23),
13. 8460960 - Method for fabricating integrated circuit (2013-06-11),
14. 8384214 - Semiconductor structure, pad structure and protection structure (2013-02-26),
15. 8379312 - Method of fabricating contiguous microlens array (2013-02-19),

Title: Innovations of Ming-I Wang in MEMS Technology

Introduction

Ming-I Wang, a prominent inventor based in Taipei County, Taiwan, has made significant contributions to the field of micro-electro-mechanical systems (MEMS) technology. With a remarkable portfolio of 25 patents to his name, he has focused primarily on the development and fabrication methods for MEMS devices that are instrumental in various applications.

Latest Patents

Among his latest patents are several innovative designs and methodologies. One notable patent is the "Structure of MEMS Electroacoustic Transducer," which details a micro-electro-mechanical systems device involving a substrate, a diaphragm with openings, a silicon material layer for sealing, and a conductive pattern positioned beneath the diaphragm. A critical feature of this invention is the formation of a first cavity between the diaphragm and the substrate, enhancing its acoustic properties.

Another significant patent is the "Method for Fabricating MEMS Device with Protection Rings." This invention outlines a systematic approach for fabricating MEMS devices, involving the separation of circuit and MEMS regions on a substrate, formation of an interconnection structure, and creation of electrodes with enclosed spaces that improve the functionality of the MEMS device.

Career Highlights

Ming-I Wang currently works at United Microelectronics Corporation (UMC), a leading global semiconductor foundry renowned for its advanced integrated circuit fabrication processes. His work at UMC has been pivotal in advancing MEMS technology, positioning the company as a key player in the industry.

Collaborations

Throughout his career, Ming-I has collaborated with talented peers, including Chien-Hsin Huang and Bang-Chiang Lan. These collaborations have not only strengthened their collective expertise but also accelerated innovations in MEMS technology through shared insights and research efforts.

Conclusion

Ming-I Wang's contributions to MEMS technology are exemplary of how innovation can drive progress in the semiconductor industry. With his extensive patent portfolio, he continues to influence the future of MEMS devices, solidifying his status as a leading inventor in this dynamic field.

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